WIRING BOARD AND MANUFACTURING METHOD OF THE SAME

• Main Authors: SATO HIRONORI, HIGO ICHIEI, YAMADA ERINA
• Format: Patent
• Language: English
• Published: 05.07.2012
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a wiring board including a conductor post which deals with high density assembly, and to provide a manufacturing method of the wiring board.SOLUTION: A wiring board 10 includes a conductor layer 12, a solder resist layer 13 laminated on the conductor layer 12, and a conductor post 16 which establishes electrical continuity with the conductor layer 12a disposed on the lower side of a through hole 131 provided at the solder resist layer 13. The solder resist layer 13 includes a thermosetting resin. The conductor post 16 is composed mainly of stannum, copper, or solder and has a lower conductor post 161 positioned in the through hole 131 and an upper conductor post 162 positioned on the lower conductor post 161 and extends toward the outside of the solder resist layer 13. At least a part of a lower end surface 162b of the upper conductor post 162 is closely in contact with an exterior surface 132 of the solder resist layer 13.