LAMINATED STRUCTURE, AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a method by which a highly reliable semiconductor module can be simply manufactured using an insulating resin adhesive sheet as an insulating substrate material.SOLUTION: A laminated structure 3 includes: a semiconductor element 1; a lead frame 21 supporting the semi...

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Bibliographic Details
Main Authors TAUCHI SHIGEAKI, O KOEN, ANDO TOMONORI, TAKARABE SATOSHI
Format Patent
LanguageEnglish
Published 20.10.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a method by which a highly reliable semiconductor module can be simply manufactured using an insulating resin adhesive sheet as an insulating substrate material.SOLUTION: A laminated structure 3 includes: a semiconductor element 1; a lead frame 21 supporting the semiconductor element 1 via a junction layer 17; a first metal foil layer 25 joined with the lead frame 21 via a junction layer 23 in such a way that electricity and heat can be conducted; an insulating resin adhesive layer 27 bonded to the first metal foil layer 25; a second metal foil layer 29 bonded to the insulating resin adhesive layer 27; and a spacer 33 joined with the second metal foil layer 29 via a junction layer 31 in such a way that heat can be conducted and serving as a heat transfer metal layer mediating heat conduction to a heat sink.
Bibliography:Application Number: JP20110050563