METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING ELEMENT

• Main Authors: NISHIWAKI WAKANA, AKAIKE YASUHIKO
• Format: Patent
• Language: English
• Published: 06.10.2011
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor light emitting element capable of improving yield in manufacture by suppressing breaking or cracking, when jointing two substrates together.SOLUTION: The method for manufacturing a semiconductor light emitting element, in which a first laminate containing a first substrate, a semiconductor layer, and a first metal layer is pasted to a second laminate containing a second substrate and a second metal layer, includes a step in which cleavage direction of the first laminate is deviated from the cleavage direction of the second laminate, and the first metal layer and the second metal layer are caused to contact to each other and overlap with each other; and a step in which temperature is raised to a predetermined value, while a weight is applied between the first laminate and the second laminate, so that the first laminate and the second laminate are pasted together.