METHOD OF FORMING CONDUCTOR PATTERN, AND DEVICE FOR EJECTING DROPLET

• Main Authors: KOBAYASHI TOSHIYUKI, TOYODA NAOYUKI, HAMA YOSHIKAZU, UEHARA NOBORU, TANABE KENTARO
• Format: Patent
• Language: English
• Published: 01.09.2011
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a method of forming a conductor pattern, and the like, capable of forming a high-reliability conductor pattern by preventing occurrence of a crack, disconnection or the like. SOLUTION: This method of forming a conductor pattern includes: a conductor pattern precursor formation process of ejecting, by a droplet ejection method, droplets of ink onto a base material to be dried to form a precursor of a conductor pattern including a pad part and a wiring part to be connected to the pad part on the base material; and a baking process. A pad part formation region includes a first region located on an extension line of a wiring part formation region, second regions located on both sides of the first region through the first region, and third regions located in side parts of the respective second regions on the side opposite to the first region. In the conductor pattern precursor formation process, the droplets of the ink are ejected in the pad part formation region so that density of attaching points in the second region for attaching the droplets of the ink thereto is set lower than those of both the first and third regions. COPYRIGHT: (C)2011,JPO&INPIT