PIEZOELECTRIC VIBRATING DEVICE AND METHOD FOR MANUFACTURING SAME

• Main Authors: ICHIKAWA RYOICHI, KAWAHARA HIROSHI
• Format: Patent
• Language: English
• Published: 28.04.2011
• Subjects: BASIC ELECTRIC ELEMENTS; BASIC ELECTRONIC CIRCUITRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a method for manufacturing a piezoelectric vibrating device that raises productivity. SOLUTION: A method for manufacturing a piezoelectric vibrating device includes the steps of: preparing a piezoelectric wafer on which a plurality of piezoelectric frames are formed (S112); preparing a lid wafer on which a plurality of lids are formed (S102), each sized substantially similarly to the frames; preparing a base wafer on which a plurality of bases are formed (S122), each base having through-holes passing from one side to the other side; forming a first bonding film along the frames on both surfaces of the piezoelectric wafer (S104); forming a second bonding film to meet the first bonding film on one surface of the lid wafer (S114); forming a third bonding film so as to meet the first bonding film on one surface of the base wafer (S124); disposing a bonding material between the first bonding film and the second bonding film and between the first bonding film and the third bonding film (S152); and bonding the piezoelectric wafer, the lid wafer and the base wafer (S154). COPYRIGHT: (C)2011,JPO&INPIT