NOZZLE POSITION CONTROLLING DEVICE AND METHOD

• Main Authors: WADA KAZUSANE, KURISU YASUSHI
• Format: Patent
• Language: English
• Published: 21.04.2011
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide a continuous plating device and a method therefor in which the variation of a metal strip at a wiping nozzle position is suppressed to reduce variation in the coating weight of a molten metal caused by the vibration. SOLUTION: The continuous hot dip plating device 1 includes: a moving mechanism 30, for controlling the position of a wiping nozzle 9 spraying a gas on the surface of a metal strip 2 pulled up from a plating bath 3 to a vertical direction, moving the wiping nozzle 9 within a prescribed movable range to the vertical direction; a detection part 20 arranged adjacently to the metal strip 2 and detecting the amplitude of the metal strip 2; and a control part 40 deciding a vertical position at which the amplitude of the metal strip 2 reaches an allowable value or below within the movable range of the wiping nozzle 9 based on the detected result by the detection part 20, controlling the moving mechanism 30 and moving the wiping nozzle 9 to the vertical position. COPYRIGHT: (C)2011,JPO&INPIT