METHOD FOR DISMOUNTING ELECTRONIC COMPONENT

• Main Author: AZUMA SHUJI
• Format: Patent
• Language: English
• Published: 16.09.2010
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

PROBLEM TO BE SOLVED: To provide a method for dismounting electronic components for dismounting electronic components without damaging a printed board. SOLUTION: An electronic component 15 is immersed in inert fluid 32 heated in a heating tank 31, thus the electronic component 15 is exposed to inert fluid 32 and heated. The thermal energy is conducted to a solder 24 through a terminal pin 18 inserted into a through-hole 21, for example. The solder 24 is heated and melted in the through-hole 21. Then the electronic component 15 falls into the heating tank 31 by gravity. Therefore the electronic component 15 is dismounted from a printed board 14. A reaction with the through-hole 21, for example, on a surface of the printed board 14 is prevented securely because inert fluid 32 is used to heat the solder 24. The damage of the printed board 14 can be avoided securely. COPYRIGHT: (C)2010,JPO&INPIT