INSULATING SUBSTRATE HAVING HIGH THERMAL EXPANSION COEFFICIENT AND LOW THERMAL CONDUCTIVITY

• Main Authors: AOKI TOMOHIRO, HOTTA MASAYA, MORIMITSU HIDEKI, WIFF VERDUGO JUAN PAULO, KINEMUCHI YOSHIAKI, ISHIGURO HIROYUKI, NAGASAKA MASAHIKO, WATARI KOJI, UCHIMURA KATSUJI
• Format: Patent
• Language: English
• Published: 02.09.2010
• Subjects: ARTIFICIAL STONE; BASIC ELECTRIC ELEMENTS; CABLES; CEMENTS; CERAMICS; CHEMISTRY; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS; COMPOUNDS THEREOF; CONCRETE; CONDUCTORS; ELECTRICITY; INORGANIC CHEMISTRY; INSULATORS; LIME, MAGNESIA; METALLURGY; NON-METALLIC ELEMENTS; REFRACTORIES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SLAG; TREATMENT OF NATURAL STONE

PROBLEM TO BE SOLVED: To provide an insulating material for an insulating substrate having a high thermal expansion coefficient and a low thermal conductivity and to provide its manufacturing method and its application product. SOLUTION: In the insulating material for the insulating substrate constituting a thermoelectric generation element composed of an aluminum silicate compact having a chemical composition KAlSi2+xO6+2x(0.5≤x≤1.8), the insulating material for the insulating substrate constituting the thermoelectric generation element composed of a dense aluminum silicate ceramic having a relative density of ≥95% and having a characteristic wherein the reduction of generating capacity due to thermal fatigue is controlled, its manufacturing method and its application product are provided. The insulating substrate having the high thermal expansion coefficient and the low thermal conductivity is provided and a thermoelectric element having an excellent thermal fatigue and a high output characteristic and using the insulating substrate is provided. COPYRIGHT: (C)2010,JPO&INPIT