SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
PROBLEM TO BE SOLVED: To provide a semiconductor device and its production process being a gate electrode type and capable of suppressing ion resistance by a simple structure. SOLUTION: P-type regions 2, 4 are provided on a first n-type region 1. A second n-type region 3 is provided on the p-type re...
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Format | Patent |
Language | English |
Published |
25.02.2010
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Abstract | PROBLEM TO BE SOLVED: To provide a semiconductor device and its production process being a gate electrode type and capable of suppressing ion resistance by a simple structure. SOLUTION: P-type regions 2, 4 are provided on a first n-type region 1. A second n-type region 3 is provided on the p-type regions 2, 4 spaced apart from the first n-type region 1 by the p-type regions 2, 4. A gate electrode 8 serves to form an n-channel between the first and second n-type regions 1, 3. A first electrode 6 is electrically connected to each of the p-type region 4 and the second n-type region 3. A second electrode 11 is provided on the first n-type region 1 such that it is spaced apart from the p-type region 2 by the first n-type region 1 and at least a part thereof is in contact with the first n-type region 1. The second electrode 11 is made of any of metal and alloy, and serves to inject holes into the first n-type region 1. COPYRIGHT: (C)2010,JPO&INPIT |
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AbstractList | PROBLEM TO BE SOLVED: To provide a semiconductor device and its production process being a gate electrode type and capable of suppressing ion resistance by a simple structure. SOLUTION: P-type regions 2, 4 are provided on a first n-type region 1. A second n-type region 3 is provided on the p-type regions 2, 4 spaced apart from the first n-type region 1 by the p-type regions 2, 4. A gate electrode 8 serves to form an n-channel between the first and second n-type regions 1, 3. A first electrode 6 is electrically connected to each of the p-type region 4 and the second n-type region 3. A second electrode 11 is provided on the first n-type region 1 such that it is spaced apart from the p-type region 2 by the first n-type region 1 and at least a part thereof is in contact with the first n-type region 1. The second electrode 11 is made of any of metal and alloy, and serves to inject holes into the first n-type region 1. COPYRIGHT: (C)2010,JPO&INPIT |
Author | MORIYA JUNICHI AONO SHINJI |
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Snippet | PROBLEM TO BE SOLVED: To provide a semiconductor device and its production process being a gate electrode type and capable of suppressing ion resistance by a... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME |
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