HEAT SINK

PROBLEM TO BE SOLVED: To solve a problem that, in a heat sink formed by combining conventional plate materials, since a heat radiating portion is thermally segmented, a small heating element is not directly connected to each heat radiating portion, causing the degradation of heat radiation performan...

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Bibliographic Details
Main Authors SASAKI CHIKA, ISEMURA MASAKAZU
Format Patent
LanguageEnglish
Published 28.01.2010
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To solve a problem that, in a heat sink formed by combining conventional plate materials, since a heat radiating portion is thermally segmented, a small heating element is not directly connected to each heat radiating portion, causing the degradation of heat radiation performance. SOLUTION: The heat sink includes a heat radiating fin portion equipped with a heat receiving surface allowing the heating element to be directly attached, which is formed by arranging a plurality of plate materials having a heat receiving portion formed by folding the vicinity of one side at almost right angle, in almost parallel to the thickness direction of the plate materials, and a connecting member which thermally connects the plurality of plate materials while being attached to the back face of the heat receiving surface. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20080181033