PATTERN FORMATION METHOD, METHOD OF MANUFACTURING SUBSTRATES BY THE SAME, SUBSTRATE, AND PATTERN FORMATION APPARATUS

• Main Author: TSUTSUI YOSHITAKA
• Format: Patent
• Language: English
• Published: 05.11.2009
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SEMICONDUCTOR DEVICES; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

PROBLEM TO BE SOLVED: To carry out a surface treatment at a low cost by a method which enables the control of liquid-repellency in patterning using an ink-jet manner. SOLUTION: A coating liquid for providing a substrate with liquid-repellency is applied to a substrate by ink-jet manner and dried to control the surface condition and thereafter a liquid material for pattern formation is discharged to the substrate, dried, and fired to form a pattern. COPYRIGHT: (C)2010,JPO&INPIT