METHOD FOR MANUFACTURING FIBER SUBSTRATE ELEMENT, AND FIBER SUBSTRATE ELEMENT

• Main Authors: NAKAJIMA AKIFUMI, KOAIZAWA HISASHI, SHU IMEI
• Format: Patent
• Language: English
• Published: 22.10.2009
• Subjects: ADVERTISING; BASIC ELECTRIC ELEMENTS; CRYPTOGRAPHY; DISPLAY; DISPLAYING; EDUCATION; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LABELS OR NAME-PLATES; PHYSICS; SEALS; SEMICONDUCTOR DEVICES; SIGNS

PROBLEM TO BE SOLVED: To easily obtain an electrical connection between conductive films sandwiching an insulating film formed on a fiber substrate element. SOLUTION: When an element and/or a wiring line are/is formed on the surface of a fiber substrate 1 with the roughly rectangular fiber substrate 1 as a substrate, a first conductive layer 2 is formed on the surface 1a of the fiber substrate 1 and a surface 1b adjacent to the surface 1a, and an insulating film 3 is formed covering the first conductive film of at least the surface 1a. Then, a second conductive layer 4 is formed on the surfaces 1a and 1b to cover the insulating film 3 and the first conductive film 2 formed on the surface 1b, and a connection part 5 is formed to electrically interconnect the first and the second conductive films 2 and 4 on the surface 1b. COPYRIGHT: (C)2010,JPO&INPIT