METHOD FOR MANUFACTURING FIBER SUBSTRATE ELEMENT, AND FIBER SUBSTRATE ELEMENT
PROBLEM TO BE SOLVED: To easily obtain an electrical connection between conductive films sandwiching an insulating film formed on a fiber substrate element. SOLUTION: When an element and/or a wiring line are/is formed on the surface of a fiber substrate 1 with the roughly rectangular fiber substrate...
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Format | Patent |
Language | English |
Published |
22.10.2009
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Abstract | PROBLEM TO BE SOLVED: To easily obtain an electrical connection between conductive films sandwiching an insulating film formed on a fiber substrate element. SOLUTION: When an element and/or a wiring line are/is formed on the surface of a fiber substrate 1 with the roughly rectangular fiber substrate 1 as a substrate, a first conductive layer 2 is formed on the surface 1a of the fiber substrate 1 and a surface 1b adjacent to the surface 1a, and an insulating film 3 is formed covering the first conductive film of at least the surface 1a. Then, a second conductive layer 4 is formed on the surfaces 1a and 1b to cover the insulating film 3 and the first conductive film 2 formed on the surface 1b, and a connection part 5 is formed to electrically interconnect the first and the second conductive films 2 and 4 on the surface 1b. COPYRIGHT: (C)2010,JPO&INPIT |
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AbstractList | PROBLEM TO BE SOLVED: To easily obtain an electrical connection between conductive films sandwiching an insulating film formed on a fiber substrate element. SOLUTION: When an element and/or a wiring line are/is formed on the surface of a fiber substrate 1 with the roughly rectangular fiber substrate 1 as a substrate, a first conductive layer 2 is formed on the surface 1a of the fiber substrate 1 and a surface 1b adjacent to the surface 1a, and an insulating film 3 is formed covering the first conductive film of at least the surface 1a. Then, a second conductive layer 4 is formed on the surfaces 1a and 1b to cover the insulating film 3 and the first conductive film 2 formed on the surface 1b, and a connection part 5 is formed to electrically interconnect the first and the second conductive films 2 and 4 on the surface 1b. COPYRIGHT: (C)2010,JPO&INPIT |
Author | KOAIZAWA HISASHI SHU IMEI NAKAJIMA AKIFUMI |
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Snippet | PROBLEM TO BE SOLVED: To easily obtain an electrical connection between conductive films sandwiching an insulating film formed on a fiber substrate element.... |
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SubjectTerms | ADVERTISING BASIC ELECTRIC ELEMENTS CRYPTOGRAPHY DISPLAY DISPLAYING EDUCATION ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LABELS OR NAME-PLATES PHYSICS SEALS SEMICONDUCTOR DEVICES SIGNS |
Title | METHOD FOR MANUFACTURING FIBER SUBSTRATE ELEMENT, AND FIBER SUBSTRATE ELEMENT |
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