PLATED COMPONENT AND METHOD OF MANUFACTURING THE SAME

• Main Author: ASAI TADASHI
• Format: Patent
• Language: English
• Published: 17.09.2009
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

PROBLEM TO BE SOLVED: To make effort at a composition of a coated surface of a member consisting essentially of copper to prevent the development of whisker and to structure a high reliable terminal component or the like for a flexible wiring connection. SOLUTION: The terminal component is provided with a terminal base material 1 consisting essentially of copper and a Sn-Ag-Cu alloy plated coating film 3 electroplated on the terminal base material 1 and having 3-7 wt.% concentration of a Ag composition, 0.3-0.7 wt.% concentration of Cu composition and remaining Sn composition. The plated coating film 3 has Ag or a compound consisting essentially of Ag deposited on the surface of the plated coating film 3 by a prescribed heat treatment. In the structure, Ag or the compound consisting essentially Ag deposited on the surface of a FPC connector terminal 10 occupies ≥2% of total surface area of the FPC connector terminal 10. Then, the development of the whisker is prevented by allowing Ag or the compound consisting essentially of Ag to function as a barrier. COPYRIGHT: (C)2009,JPO&INPIT