SEMICONDUCTOR DEVICE

• Main Authors: NAKAO YUICHI, KAGEYAMA SATOSHI
• Format: Patent
• Language: English
• Published: 14.05.2009
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a semiconductor device preventing occurrence of disconnection of upper layer wiring due to stress even if width of wiring is not more than 0.4 μm. SOLUTION: A second interlayer insulating film 5 is laminated on first wiring 4 formed on a prescribed pattern. A second...