QUANTIFICATION OF HYDROPHOBIC, AND HYDROPHILIC PROPERTIES OF MATERIALS
PROBLEM TO BE SOLVED: To provide a non-destructive and simple analytical method which allows in-situ monitoring of plasma damage during the plasma processing, such as, resist stripping. SOLUTION: If a low-dielectric-constant (low-k) film is damaged during plasma processing, one of the reaction produ...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
26.03.2009
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Subjects | |
Online Access | Get full text |
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