QUANTIFICATION OF HYDROPHOBIC, AND HYDROPHILIC PROPERTIES OF MATERIALS

PROBLEM TO BE SOLVED: To provide a non-destructive and simple analytical method which allows in-situ monitoring of plasma damage during the plasma processing, such as, resist stripping. SOLUTION: If a low-dielectric-constant (low-k) film is damaged during plasma processing, one of the reaction produ...

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Bibliographic Details
Main Authors URBANOWICZ ADAM MICHAL, BAKLANOV MIKHAIL
Format Patent
LanguageEnglish
Published 26.03.2009
Subjects
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