LIQUID APPLYING APPARATUS

PROBLEM TO BE SOLVED: To provide a high efficiency liquid applying apparatus having a simple structure. SOLUTION: The liquid applying apparatus 100 for spraying the liquid L and coating a material 50 to be coated with the liquid L is provided with a conductive body 14 having a spray hole 15 formed t...

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Bibliographic Details
Main Authors MOTOBE YUKIHIRO, ARAI KOJI, NAGAHAMA MASANOBU
Format Patent
LanguageEnglish
Published 06.11.2008
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Summary:PROBLEM TO BE SOLVED: To provide a high efficiency liquid applying apparatus having a simple structure. SOLUTION: The liquid applying apparatus 100 for spraying the liquid L and coating a material 50 to be coated with the liquid L is provided with a conductive body 14 having a spray hole 15 formed to spray the liquid L and supported elastically, a stage 52 for placing the material 50 to be coated and a power source 20 for applying a prescribed potential grounded on the stage 52 to the conductive body 14. By the structure, the conductive body 14 causes vibration to cut the liquid L by the edges around the spray hole to form fine mist and to deposit on the wide area of the material 50 to be coated. COPYRIGHT: (C)2009,JPO&INPIT
Bibliography:Application Number: JP20070110919