MICROMECHANICAL RESONATOR
PROBLEM TO BE SOLVED: To provide a micromechanical resonator capable of using a resonance frequency in a frequency band higher than that of a conventional micromechanical resonator. SOLUTION: The micromechanical resonator has, on a substrate 7, a resonator 2 having a plane shape parallel to the subs...
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Format | Patent |
Language | English |
Published |
30.10.2008
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Abstract | PROBLEM TO BE SOLVED: To provide a micromechanical resonator capable of using a resonance frequency in a frequency band higher than that of a conventional micromechanical resonator. SOLUTION: The micromechanical resonator has, on a substrate 7, a resonator 2 having a plane shape parallel to the substrate 7, and a pair of electrodes 30 and 31 disposed on both sides of the resonator 2. The resonator 2 has a thin disk portion 20 disposed at a center part and a thick annular portion 50 which is thicker than the thin disk portion 20 and encloses the thin disk portion 20. The thick annular portion 50 is supported on the substrate 7 and the pair of electrodes 30 and 31 form a gap portion with the thin disk portion 20 of the resonator 2. A main voltage is applied to the resonator 2, and a high-frequency signal is input to the pair of electrodes 30 and 31, so that variation in electrostatic capacity between the resonator 2 and pair of electrodes 30 and 31 is output in the form of a high-frequency signal. COPYRIGHT: (C)2009,JPO&INPIT |
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AbstractList | PROBLEM TO BE SOLVED: To provide a micromechanical resonator capable of using a resonance frequency in a frequency band higher than that of a conventional micromechanical resonator. SOLUTION: The micromechanical resonator has, on a substrate 7, a resonator 2 having a plane shape parallel to the substrate 7, and a pair of electrodes 30 and 31 disposed on both sides of the resonator 2. The resonator 2 has a thin disk portion 20 disposed at a center part and a thick annular portion 50 which is thicker than the thin disk portion 20 and encloses the thin disk portion 20. The thick annular portion 50 is supported on the substrate 7 and the pair of electrodes 30 and 31 form a gap portion with the thin disk portion 20 of the resonator 2. A main voltage is applied to the resonator 2, and a high-frequency signal is input to the pair of electrodes 30 and 31, so that variation in electrostatic capacity between the resonator 2 and pair of electrodes 30 and 31 is output in the form of a high-frequency signal. COPYRIGHT: (C)2009,JPO&INPIT |
Author | TAMANO AKIMASA NAGASAKI HIRONORI |
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RelatedCompanies | SANYO ELECTRIC CO LTD |
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Snippet | PROBLEM TO BE SOLVED: To provide a micromechanical resonator capable of using a resonance frequency in a frequency band higher than that of a conventional... |
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SubjectTerms | BASIC ELECTRONIC CIRCUITRY ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS RESONATORS TRANSPORTING |
Title | MICROMECHANICAL RESONATOR |
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