LAMINATED SEMICONDUCTOR PACKAGE AND LIGHT-SIGNAL TRANSMITTER

• Main Authors: SATO YASUHIRO, KOTAKE NAOSHI
• Format: Patent
• Language: English
• Published: 31.01.2008
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a laminated semiconductor package having an excellent heat-dissipating property, and enabling a high-speed transmission and a light-signal transmitter with such a laminated semiconductor package. SOLUTION: A semiconductor chip 112 for processing an electronic signal inputting and outputting the electronic signal is mounted on a package substrate 111 for the semiconductor package 110 as an uppermost layer. An optoelectric transducer 123 bearing a conversion between the electronic signal and a light signal is mounted on the package substrate 121 for the semiconductor package 120 as an intermediate layer. The semiconductor chip 132 for processing the electronic signal inputting and outputting the electronic signal is mounted on the package substrate 131 for the semiconductor package 130 as a lowermost layer. An optical waveguide 170 bearing the propagation of a signal light is formed on the optoelectric transducer 123 mounted on the semiconductor package 120 as the intermediate layer, and the optical waveguide 170 is connected optically to the optoelectric transducer 123 by a mirror 170a. COPYRIGHT: (C)2008,JPO&INPIT