SENSOR DEVICE

• Main Authors: OKUTO TAKASHI, MIYAJIMA HISAKAZU, KATAOKA KAZUSHI, BABA TORU, GOTO KOJI, SAIJO TAKASHI
• Format: Patent
• Language: English
• Published: 11.10.2007
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT; MEASURING; MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PHYSICS; SEMICONDUCTOR DEVICES; TESTING; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a sensor device of which the height can be decreased by regulating the travel of a movable section by a package and performing flip-chip packaging. SOLUTION: A sensor chip 1 is formed on a semiconductor substrate, and has a sensing section Ds and an electrode 19. The sensing section Ds has a mass body 12 and a deflection section 13 allowed to be deflected in the thickness direction of the sensor chip 1. The sensor chip 1 is stored in a package comprising an electrode formation substrate 2 and a cover substrate 3, and a bump 21 is formed on one surface that opposes the sensor chip 1 on the inner surface of the package. The bump 21 is used for performing the flip-chip packaging of the sensor chip 1, and the projection dimensions of the bump 21 are set so that they permit the displacement of the mass body 12 and regulate the amount of displacement in the mass body 12. Therefore, the electrode formation substrate 2 functions as a stopper for regulating the travel of the mass body 12. COPYRIGHT: (C)2008,JPO&INPIT