METHOD FOR REFORMING RESIN BASE MATERIAL

PROBLEM TO BE SOLVED: To provide a reforming method for reforming the surface of a resin base material while moving the resin base material at a rate of ≥300 mm/min under the atmospheric pressure. SOLUTION: In the method for reforming the surface of a resin material, the surface of a target 13 is ir...

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Bibliographic Details
Main Authors TATE KAZUYUKI, NARITA TAKESHI, AZUMA HIROZUMI, TAKEUCHI AKIHIRO
Format Patent
LanguageEnglish
Published 02.08.2007
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Summary:PROBLEM TO BE SOLVED: To provide a reforming method for reforming the surface of a resin base material while moving the resin base material at a rate of ≥300 mm/min under the atmospheric pressure. SOLUTION: In the method for reforming the surface of a resin material, the surface of a target 13 is irradiated with laser light L to generate vacuum ultraviolet light and scattering particles (a), and the scattering particles (a) are stuck to the surface of the resin base material 15 while irradiating the same with the vacuum ultraviolet light. While the surface of the target 13 is irradiated with the laser light L in such a manner that the shape of the irradiated light formed on the surface of the target 13 is made into the almost elliptical one in which the width in the major axis direction reaches 1.5 to 10 times the width in the minor axis direction, the resin base material 15 is moved in such a manner that the opening angle between the direction vertical to the major axis direction in the plane parallel to the surface of the target 13 and the moving direction of the resin base material 15 becomes ≤10°, and the scattering particles (a) are stuck to the surface of the resin base material 15 in a shielding gas atmosphere having an oxygen content of ≤8 vol.% while irradiating the surface of the resin base material 15 with the vacuum ultraviolet light. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20060011625