LIGHT-EMITTING DEVICE
PROBLEM TO BE SOLVED: To provide a light-emitting device for reducing variations in the color of generated light and reducing height by restraining height dimensions. SOLUTION: The light-emitting device includes an LED chip 10; a packaging substrate 20 where the LED chip 10 is packaged; a frame 40 f...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
05.04.2007
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Online Access | Get full text |
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Abstract | PROBLEM TO BE SOLVED: To provide a light-emitting device for reducing variations in the color of generated light and reducing height by restraining height dimensions. SOLUTION: The light-emitting device includes an LED chip 10; a packaging substrate 20 where the LED chip 10 is packaged; a frame 40 for surrounding the LED chip 10 at the packaging surface side of the packaging substrate 20; a sealing section 50 that is formed by filling a transparent silicon resin to the inside of the frame, seals the LED chip 10 and bonding wires 14, 14, and is elastic; a Fresnel lens 60 arranged while being overlapped to the sealing section 50; and a cylindrical color conversion member 70 that is a molding in which a phosphor excited by light radiated from the LED chip and radiates light with a color differing from the luminescent color of the LED chip is formed with a transparent material, covers the Fresnel lens at the side of a light emission surface 60b of the Fresnel lens 60, and is arranged while an air layer 80 is formed between the light emission surface and the frame 40. COPYRIGHT: (C)2007,JPO&INPIT |
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AbstractList | PROBLEM TO BE SOLVED: To provide a light-emitting device for reducing variations in the color of generated light and reducing height by restraining height dimensions. SOLUTION: The light-emitting device includes an LED chip 10; a packaging substrate 20 where the LED chip 10 is packaged; a frame 40 for surrounding the LED chip 10 at the packaging surface side of the packaging substrate 20; a sealing section 50 that is formed by filling a transparent silicon resin to the inside of the frame, seals the LED chip 10 and bonding wires 14, 14, and is elastic; a Fresnel lens 60 arranged while being overlapped to the sealing section 50; and a cylindrical color conversion member 70 that is a molding in which a phosphor excited by light radiated from the LED chip and radiates light with a color differing from the luminescent color of the LED chip is formed with a transparent material, covers the Fresnel lens at the side of a light emission surface 60b of the Fresnel lens 60, and is arranged while an air layer 80 is formed between the light emission surface and the frame 40. COPYRIGHT: (C)2007,JPO&INPIT |
Author | KAMATA SAKUO URANO YOJI NISHIOKA YASUSHI |
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Snippet | PROBLEM TO BE SOLVED: To provide a light-emitting device for reducing variations in the color of generated light and reducing height by restraining height... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | LIGHT-EMITTING DEVICE |
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