LED LUMINAIR

PROBLEM TO BE SOLVED: To provide an LED luminair which is low in cost and superior in heat dissipation of an LED element and excels in the degree of completion of design as well as light emitting efficiency. SOLUTION: A substrate 4 is provided with a plurality of through-holes 4c of which insides an...

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Main Authors GOTO YOSHIRO, KIYOZUMI KATSUYUKI
Format Patent
LanguageEnglish
Published 29.03.2007
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Abstract PROBLEM TO BE SOLVED: To provide an LED luminair which is low in cost and superior in heat dissipation of an LED element and excels in the degree of completion of design as well as light emitting efficiency. SOLUTION: A substrate 4 is provided with a plurality of through-holes 4c of which insides and opening peripheries are subjected to through-hole plating 5. An LED element 2 is arranged on the rear surface 4b of the substrate 4 so that a light emitter 2c and a lens 2d may be inserted to the through-hole 4c from the rear surface 4b, and the surface of the light emitter 2c of a mounting part 2b is soldered onto the rear surface 4b. In this case, the lens 2d is exposed on the side of the surface 4 of the substrate 4 through the through-hole 4c. Therefore, a light emitting to the inside of the through-hole 4c from the light emitter 2c is reflected on the through-hole plating 5 formed on the inside of the through-hole 4c, and it is led out to the outside through the through-hole 4c and a hole 10 of a cover 1b. COPYRIGHT: (C)2007,JPO&INPIT
AbstractList PROBLEM TO BE SOLVED: To provide an LED luminair which is low in cost and superior in heat dissipation of an LED element and excels in the degree of completion of design as well as light emitting efficiency. SOLUTION: A substrate 4 is provided with a plurality of through-holes 4c of which insides and opening peripheries are subjected to through-hole plating 5. An LED element 2 is arranged on the rear surface 4b of the substrate 4 so that a light emitter 2c and a lens 2d may be inserted to the through-hole 4c from the rear surface 4b, and the surface of the light emitter 2c of a mounting part 2b is soldered onto the rear surface 4b. In this case, the lens 2d is exposed on the side of the surface 4 of the substrate 4 through the through-hole 4c. Therefore, a light emitting to the inside of the through-hole 4c from the light emitter 2c is reflected on the through-hole plating 5 formed on the inside of the through-hole 4c, and it is led out to the outside through the through-hole 4c and a hole 10 of a cover 1b. COPYRIGHT: (C)2007,JPO&INPIT
Author KIYOZUMI KATSUYUKI
GOTO YOSHIRO
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Snippet PROBLEM TO BE SOLVED: To provide an LED luminair which is low in cost and superior in heat dissipation of an LED element and excels in the degree of completion...
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title LED LUMINAIR
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