HOUSING FOR ACCOMMODATING SOLID-STATE IMAGING DEVICE, AND SOLID-STATE IMAGING APPARATUS

PROBLEM TO BE SOLVED: To provide a housing for accommodating a solid-state imaging device in which warp during housing formation is suppressed, and deformation due to heat is small during packaging, and to provide a solid-state imaging apparatus with high operational reliability in which read error...

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Bibliographic Details
Main Authors YOSHIDA YOSHIHIDE, MAEDA MITSUO, SATO TOMOHIRO
Format Patent
LanguageEnglish
Published 28.09.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PICTORIAL COMMUNICATION, e.g. TELEVISION
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a housing for accommodating a solid-state imaging device in which warp during housing formation is suppressed, and deformation due to heat is small during packaging, and to provide a solid-state imaging apparatus with high operational reliability in which read error hardly occurs even if working temperature varies. SOLUTION: A hollow resin case for accommodating a solid-state imaging device is integrally formed of an approximately rectangular resin bottom plate, and resin side walls having the same outline area as that of the bottom plate and being provided approximately perpendicularly to the bottom plate. Further, the case has a metal lead terminal inserted therein, and has an opening closable by a transparent plate. The case has at least one rib provided perpendicularly to a longitudinal direction of a bottom of the bottom plate. A solid-state imaging apparatus is provided with this case. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20060037484