METAL COMPONENT USED IN MANUFACTURING WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE USING IT

• Main Authors: KOTAKE HIDEKI, KUROSAWA INATARO, HASHIMOTO YUKIO
• Format: Patent
• Language: English
• Published: 31.08.2006
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a metal component used in manufacturing a wiring substrate which can elevate adhesion and connectivity with various films and layers where an insulating material of a surface is formed on it, and which is formed to be buried so that the surface of the wiring film itself is on a level with the surface of the insulating material by transferring the wiring film, and to provide a method for manufacturing the wiring substrate that uses it. SOLUTION: In the metal component 10 used in manufacturing the wiring substrate, an etching-preventing metal film (nickel film) 6 with a thickness smaller than and with material different from its carrier film (copper film) 2 is formed on the main rough surface 4 of the carrier film 2 on at least one main surface, and a metal film 8 for forming a wiring film with a material different from the metal film 6 is formed on the main surface opposite to the carrier film 2 of the film 6. COPYRIGHT: (C)2006,JPO&NCIPI