METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

• Main Authors: SODA EIICHI, SUDO ITSUKI, KAGEYAMA SATOSHI
• Format: Patent
• Language: English
• Published: 22.12.2005
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device with which a problem of washing in a copper wiring forming process using a low-k film can be solved. SOLUTION: A copper wiring layer 2 is formed on a silicon substrate 1; and a diffusion preventing film 7, an interlaye...