SOLDER AND ITS MANUFACTURING METHOD

• Main Authors: HAYASHI TAKAHIRO, HORIO YUUMA, IIJIMA KENZABURO, ISHIDA KIYOHITO, SEKINE MASAYOSHI, KAINUMA RYOSUKE, ONUMA IKUO, TAKAKU YOSHIKAZU, SUZUKI JUNYA, O SUIHEI
• Format: Patent
• Language: English
• Published: 23.06.2005
• Edition: 7
• Subjects: ALLOYS; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRICITY; FERROUS OR NON-FERROUS ALLOYS; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To provide a solder suitable for welding a electrothermal transmutation module and to provide its manufacturing method. SOLUTION: The solder has a structure in which one or more kinds of dispersed phases are dispersed in a matrix phase, and the dispersed phases has a solidus temperature higher than that of the matrix phase. The solidus temperature of the matrix phase of the solder is desirably ≥240°C, while the dispersed phases are desirably fine phases with the average grain size ≤5 μm. It is preferable that the solder is an alloy having a composition in which the volume fraction of the dispersed phase is ≤40%, that this alloy is particularly Bi-Cu-X radicals alloy or Bi-Zn-X radicals alloy, and that the solder is in the form of powder with the grain size ≤100 μm prepared by a liquid quenching method or a thin strip with the film thickness ≤500 μm. COPYRIGHT: (C)2005,JPO&NCIPI