LEAD FRAME, SEMICONDUCTOR DEVICE AND ITS MANUFACTURING PROCESS

PROBLEM TO BE SOLVED: To increase the number of electrodes in a mold package of a semiconductor device while suppressing increase in size of the semiconductor device. SOLUTION: In a lead frame being employed in the mold package of a semiconductor device, leads are arranged entirely including island...

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Bibliographic Details
Main Authors YAMAZAKI AKIRA, YUFU KOJI, ABE SHUNICHI, IZUMI TADAO
Format Patent
LanguageEnglish
Published 28.04.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To increase the number of electrodes in a mold package of a semiconductor device while suppressing increase in size of the semiconductor device. SOLUTION: In a lead frame being employed in the mold package of a semiconductor device, leads are arranged entirely including island parts for mounting a semiconductor chip. In the manufacturing process of the semiconductor device, after the semiconductor chip is mounted, wire bonded and resin sealed, the lead is cut appropriately depending on the number of electrodes of the semiconductor chip and divided into a plurality of leads. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20030347120