ELECTRONIC-COMPONENT MOUNTING SUBSTRATE, AND ELECTRONIC APPARATUS USING THE SAME

PROBLEM TO BE SOLVED: To provide a highly reliable electronic-component mounting substrate and an electronic apparatus wherein its miniaturizing and its thinning are made possible and any faultiness of its electrical short-circuit, etc. is not induced. SOLUTION: The electronic-component mounting sub...

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Bibliographic Details
Main Author ONIZUKA YOSHITOMO
Format Patent
LanguageEnglish
Published 14.04.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Abstract PROBLEM TO BE SOLVED: To provide a highly reliable electronic-component mounting substrate and an electronic apparatus wherein its miniaturizing and its thinning are made possible and any faultiness of its electrical short-circuit, etc. is not induced. SOLUTION: The electronic-component mounting substrate has an insulating base body 1 on the principal surface of which a rectangular mounting portion 6 for mounting an electronic component 9 therein is formed, electrode pads 2 formed in the corner portions of the mounting portion 6, and a rectangular-frame-form metallized layer 4 so formed on the principal surface of the insulating base body 1 as to surround the mounting portion 6. Further, each groove 3 is formed in one of the portions interposed between each electrode pad 2 of the principal surface and the metallized layer 4 wherefrom the corner portion of the metallized layer 4 is removed. COPYRIGHT: (C)2005,JPO&NCIPI
AbstractList PROBLEM TO BE SOLVED: To provide a highly reliable electronic-component mounting substrate and an electronic apparatus wherein its miniaturizing and its thinning are made possible and any faultiness of its electrical short-circuit, etc. is not induced. SOLUTION: The electronic-component mounting substrate has an insulating base body 1 on the principal surface of which a rectangular mounting portion 6 for mounting an electronic component 9 therein is formed, electrode pads 2 formed in the corner portions of the mounting portion 6, and a rectangular-frame-form metallized layer 4 so formed on the principal surface of the insulating base body 1 as to surround the mounting portion 6. Further, each groove 3 is formed in one of the portions interposed between each electrode pad 2 of the principal surface and the metallized layer 4 wherefrom the corner portion of the metallized layer 4 is removed. COPYRIGHT: (C)2005,JPO&NCIPI
Author ONIZUKA YOSHITOMO
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Snippet PROBLEM TO BE SOLVED: To provide a highly reliable electronic-component mounting substrate and an electronic apparatus wherein its miniaturizing and its...
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title ELECTRONIC-COMPONENT MOUNTING SUBSTRATE, AND ELECTRONIC APPARATUS USING THE SAME
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