ELECTRONIC-COMPONENT MOUNTING SUBSTRATE, AND ELECTRONIC APPARATUS USING THE SAME
PROBLEM TO BE SOLVED: To provide a highly reliable electronic-component mounting substrate and an electronic apparatus wherein its miniaturizing and its thinning are made possible and any faultiness of its electrical short-circuit, etc. is not induced. SOLUTION: The electronic-component mounting sub...
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Main Author | |
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Format | Patent |
Language | English |
Published |
14.04.2005
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a highly reliable electronic-component mounting substrate and an electronic apparatus wherein its miniaturizing and its thinning are made possible and any faultiness of its electrical short-circuit, etc. is not induced. SOLUTION: The electronic-component mounting substrate has an insulating base body 1 on the principal surface of which a rectangular mounting portion 6 for mounting an electronic component 9 therein is formed, electrode pads 2 formed in the corner portions of the mounting portion 6, and a rectangular-frame-form metallized layer 4 so formed on the principal surface of the insulating base body 1 as to surround the mounting portion 6. Further, each groove 3 is formed in one of the portions interposed between each electrode pad 2 of the principal surface and the metallized layer 4 wherefrom the corner portion of the metallized layer 4 is removed. COPYRIGHT: (C)2005,JPO&NCIPI |
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Bibliography: | Application Number: JP20040048238 |