VACUUM FILM-FORMING APPARATUS AND FILM-FORMING METHOD

• Main Author: ISHII RYOJI
• Format: Patent
• Language: English
• Published: 24.03.2005
• Edition: 7
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide a vacuum film-forming apparatus which can easily wind a film substrate, on which a film is to be formed, around a metal roll and can stably form a multilayered film on the surface of the film substrate wound around the metal roll. SOLUTION: The vacuum film-forming apparatus is at least equipped with a part for winding off the long film substrate, a pair of nip rollers for sandwiching the film substrate which has been wound off, the metal roll around which the film substrate is wound, a charged particle-emitting part for charging the film substrate and film-forming parts for forming the film on the surface of the film substrate. Here, the metal roll is located right below the nip rollers, the charged particle-emitting part is located obliquely below the nip rollers, close to the upstream surface in regard to the direction of rotation of the metal roll, and the film-forming parts are located below the metal roll. The charged particle-emitting part is made of a material which emits at least one kind of charged particles which are generated via hollow cathode discharge and accelerated by a voltage higher than -5.0 kV. The vacuum film-forming apparatus is used in a film-forming method. COPYRIGHT: (C)2005,JPO&NCIPI