OPTOELECTRONIC ASSEMBLY

• Main Authors: SHINDE SUBHASH L, FRANK L PONPEO, STIGLIANI DANIEL J JR, ALAN F BENER, MAGERLEIN JOHN H, LIN HOW TZU, EVAN G COLGAN
• Format: Patent
• Language: English
• Published: 03.03.2005
• Edition: 7
• Subjects: CALCULATING; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS

PROBLEM TO BE SOLVED: To provide an optoelectronic assembly for a computer system with respect to a mounting structure to establish optoelectronic communication between an electronic chip on a first level package and a high-density light transmitter-receiver. SOLUTION: The optoelectronic assembly includes an electronic chip 110, a substrate 120, an electric signaling medium 140, an optoelectronic transducer 160, and an optical coupling guide 170. The electronic chip is in communication with the substrate, which is in communication with a first end of the electric signaling medium. A second end of the electric signaling medium is in communication with the optoelectronic transducer. The optical coupling guide positions an optical signaling medium with respect to the optoelectronic transducer. An electric signal from the electronic chip is transmitted to the optoelectronic transducer via the substrate and the electric signaling medium. The electronic chip and the optoelectronic transducer share a common heat spreader. COPYRIGHT: (C)2005,JPO&NCIPI