DOUBLE-SIDE GROOVE MACHINING METHOD FOR THIN SHEET MATERIAL

PROBLEM TO BE SOLVED: To provide a double-side groove machining method for thin sheet material by which both machining positions of the front side and the rear side are not deviated from each other at prescribed distances from a work machining reference position to respective front V groove and rear...

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Bibliographic Details
Main Authors TAKAO YOSHIHIRO, NOMURA TADATOSHI, KAWAKAMI RYUICHI
Format Patent
LanguageEnglish
Published 17.02.2005
Edition7
Subjects
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Summary:PROBLEM TO BE SOLVED: To provide a double-side groove machining method for thin sheet material by which both machining positions of the front side and the rear side are not deviated from each other at prescribed distances from a work machining reference position to respective front V groove and rear V groove by making the work machining reference positions in common with respect to the front V groove and the rear V groove in the front and the rear surfaces of a work in a V groove machining method for an optical fiber array having double-sided grooves. SOLUTION: In the double-side groove machining method for thin sheet material, a work, i.e., a thin sheet material is suctionally fixed in a vertically rising manner and processed by a V groove machining grindstone to provide work machining reference position V grooves 8 at two places on the work top surface so that the grooves are made orthogonal to a vertical surface. Bottom tip positions 9 of the work processing reference position V grooves 8, which have no chipping in the V grooves and are machined on the front and rear surfaces of the work, are set as work machining reference positions, recognized by and aligned to an image processing device. Thus, no deviation occurs in machining positions da and db having prescribed distances from the work machining reference positions of the common bottom tip positions 9 to the front V groove and the rear V groove on the front and rear surfaces of a work 10 and no malrecognition of edges occurs in the image processing device. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20030279059