METHOD FOR PRODUCING RESIN SUBSTRATE AND INJECTION MOLDING MACHINE FOR THE SUBSTRATE

• Main Author: DEGUCHI KYOSUKE
• Format: Patent
• Language: English
• Published: 03.02.2005
• Edition: 7
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; INFORMATION STORAGE; INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER; PERFORMING OPERATIONS; PHYSICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To provide a method for producing a resin substrate which can accurately demold the resin substrate by reducing birefringence unevenness, warpage, distortion, etc. SOLUTION: In the method for producing the resin substrate in which the substrate is molded by injecting/packing a resin in a cavity 1 formed between a fixed mold and a movable mold and forming a central hole by a cut punch 21, a projection region 30 formed at the tip or in a part close to the tip of the cut punch 21, after gate cutting by advancing the cut punch 21, is extruded outside an original path and in a mold opening process after cooling, after the substrate is demolded from the fixed mold, is retracted/housed in the cut punch 21. COPYRIGHT: (C)2005,JPO&NCIPI