ATTACHMENT FOR ELECTRONIC COMPONENT PACKAGING, AND ELECTRONIC COMPONENT PACKAGING EQUIPMENT

PROBLEM TO BE SOLVED: To provide an attachment for electronic component packaging and electronic component packaging equipment which has no possibility that bonding material may adhere at the time of heat crimping, and sufficient endurance and superior cost performance. SOLUTION: This attachment 1 f...

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Bibliographic Details
Main Authors NAKAO MAKOTO, MURAKAMI YOSHIHIKO
Format Patent
LanguageEnglish
Published 27.01.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide an attachment for electronic component packaging and electronic component packaging equipment which has no possibility that bonding material may adhere at the time of heat crimping, and sufficient endurance and superior cost performance. SOLUTION: This attachment 1 for packaging a semiconductor chip is an attachment which is used in a case that the semiconductor chip is mounted on a packaging substrate through bonding material. The attachment has an attachment main part 2 which consists of ceramics such as AIN, SiC and Si3N4; and a coat layer 3 which is formed on a surface 2a of the attachment main part 2, contains one or at least two kinds selected from glass containing fluorine group and/or alkyl group, titanium oxide and fluorinated carbon, and prevents wetting with the bonding material. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20030188287