EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing having characteristics excellent in a mold release property and reliability. SOLUTION: The epoxy resin composition for semiconductor sealing comprises (A) an epoxy resin, (B) a phenol resin, (C) an inorganic filler...

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Bibliographic Details
Main Authors WASHIMI NORIYUKI, ASADA YASUTSUGU
Format Patent
LanguageEnglish
Published 27.01.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing having characteristics excellent in a mold release property and reliability. SOLUTION: The epoxy resin composition for semiconductor sealing comprises (A) an epoxy resin, (B) a phenol resin, (C) an inorganic filler, (D) a curing accelerator and (E) acetoacetic acid anilide as essential components. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20030191613