PROCESSING METHOD OF DIELECTRIC MULTILAYERED FILM FILTER SUBSTRATE

• Main Authors: TAO MASATO, YONEKURA MASAAKI, SERITA DAISUKE, OTSUKI TOYO
• Format: Patent
• Language: English
• Published: 20.01.2005
• Edition: 7
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PERFORMING OPERATIONS; PHYSICS; POLISHING; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a means which improve the yield in a step of grinding and polishing from the backside of a substrate when manufacturing a dielectric multilayered film filter. SOLUTION: In a substrate grinding step and a polishing step in manufacturing the dielectric multilayered film filter, the dielectric multilayered film filter is fixed to a support with an adhesive, and the substrate is ground and polished after having the periphery buried in a resin layer, and thus the occurrence of cracks and breaks of the substrate part and the occurrence of flaws in a substrate treated surface resulting from the cracks are prevented to be able to work the multilayered film filter with high yield. An adhesive and a resin having ≤200°C melting temperature are used as these adhesive and resin, and spherical particles are mixed in the adhesive. COPYRIGHT: (C)2005,JPO&NCIPI