MULTIPIECE WIRING BOARD

PROBLEM TO BE SOLVED: To provide a multipiece wiring board wherein a metalized layer adhered to the inside of a through hole is hardly peeled off when a ceramic mother board is divided into wiring board areas. SOLUTION: The multipiece wiring board is provided with splitting grooves 9 that are formed...

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Bibliographic Details
Main Author ONIZUKA YOSHITOMO
Format Patent
LanguageEnglish
Published 16.12.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a multipiece wiring board wherein a metalized layer adhered to the inside of a through hole is hardly peeled off when a ceramic mother board is divided into wiring board areas. SOLUTION: The multipiece wiring board is provided with splitting grooves 9 that are formed along the boarders of wiring board areas 3 on the main surface of the ceramic mother board 2 wherein the square wiring board areas 3 are arranged and formed vertically and horizontally, and a plurality of through holes 4 wherein a metalized layer 6 is adhered to their entire inside are formed crossing the splitting grooves 9. The metalized layer 6 is alternately formed in such a manner that its thin-wall and thick-wall parts gradually change in thickness in the vertical section. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20030151711