METHOD AND DEVICE FOR MOUNTING SEMICONDUCTOR CHIP, SEMICONDUCTOR MOUNTING SUBSTRATE, AND ELECTRONIC EQUIPMENT

• Main Authors: SEKI SHIGEAKI, KITO YUTAKA, MOMOSE MASASHI
• Format: Patent
• Language: English
• Published: 07.10.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a method and a device for mounting semiconductor chip by which a highly reliable semiconductor mounting substrate can be obtained. SOLUTION: In the method of mounting semiconductor chip, a plurality of semiconductor chips are brazed and soldered to the surface of a w...