VACUUM DEPOSITION SYSTEM AND DEPOSITION METHOD

• Main Author: KAMIYA KAZUO
• Format: Patent
• Language: English
• Published: 25.03.2004
• Edition: 7
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide a vacuum deposition system which can prevent the wear of electrodes for generating discharge etc., by reducing the voltage to generate plasma discharge. SOLUTION: The vacuum deposition system 30 is provided with a vacuum chamber 1, a plasma discharge electrode 2 also functioning as a substrate holder for holding a substrate, a power unit 15 for supplying electric power to cause discharge in the vacuum chamber 1 through the electrode 2, a discharge start electrode 21 and a discharge start electrode driving mechanism 25 for driving the electrode 21. The electrode 21 is arranged in an operative position and is kept at the same potential as the electrode 2 until the plasma discharge is started. When the plasma discharge by the electrode 2 is started, the plasma discharge electrode is retreated from the operative position. As a result, the voltage to start the discharge in the vacuum chamber 1 can be lowered and the voltage to generate the plasma discharge can be lowered. COPYRIGHT: (C)2004,JPO