METHOD OF MANUFACTURING PRINTED WIRING BOARD USING ADDITIVE METHOD

• Main Author: IKEGUCHI NOBUYUKI
• Format: Patent
• Language: English
• Published: 21.11.2003
• Edition: 7
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP

PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board in which the adhesive strength of plating copper can be increased and which is excellent in heat resistance, reliability, etc., by using the additive method. SOLUTION: The printed wiring board is manufactured by bondin...