METHOD OF MANUFACTURING PRINTED WIRING BOARD USING ADDITIVE METHOD

• Main Author: IKEGUCHI NOBUYUKI
• Format: Patent
• Language: English
• Published: 21.11.2003
• Edition: 7
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP

PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board in which the adhesive strength of plating copper can be increased and which is excellent in heat resistance, reliability, etc., by using the additive method. SOLUTION: The printed wiring board is manufactured by bonding B-stage resin composition layers for additive with metal foil or mold release films to both surface of prepreg. A resin composition prepared by uniformly scattering two or more components of a resin soluble in the coarsening solution of a resin composition for additive containing (a) a polyfunctional ester cyanate monomer, (b) an epoxy resin which becomes a liquid at a room temperature in an amount of 15-500 pts.wt. per 100 pts.wt. of ester cyanate prepolymer, and (c) a curing catalyst in an amount of 0.005-10 pts.wt. per 10 pts.wt. of the monomer (a) and resin (b) as essential ingredients is used as a resin insoluble in the coarsening solution of the resin composition for additive. The resin component for prepreg is composed mainly of a resin component insoluble in the coarsening solution. Consequently, the printed wiring board in which the adhesive strength of plated copper can be increased and which is excellent in heat resistance, reliability, etc., is manufactured. COPYRIGHT: (C)2004,JPO