MOUNTING STRUCTURE OF REAR FACE ELECTRODE TYPE SEMICONDUCTOR PACKAGE

• Main Author: KAWAHARA HIDENORI
• Format: Patent
• Language: English
• Published: 21.11.2003
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a mounting structure which is advantageous to a reduction in thickness and is capable of reducing the number of processes, a manufacturing lead time, a material cost, a processing cost, and a repair cost; is resistant to shock stress and thermal stress; and is capable of improving a reliability and a quality and facilitates a repair work. SOLUTION: The mounting structure of a rear face electrode type semiconductor package for mounting the rear face electrode type semiconductor package 101 having rear face electrodes 103 and 111 on a mounting substrate 108 comprises reinforcing patterns 104 formed around the rear face electrodes of the rear face electrode type semiconductor package; and land patterns 109 which are formed on the mounting substrate in correspondence with the rear face electrodes and the reinforcing patterns, and which are supplied with solder and are heated to be both electrically and mechanically connected and bonded to the rear face electrodes, and the reinforcing patterns to mount the rear face electrode type semiconductor package on the mounting substrate. COPYRIGHT: (C)2004,JPO