RESIN COMPOSITION AND METHOD OF MANUFACTURING THE SAME

• Main Authors: KISHI TOYOAKI, NAKAMICHI SEI
• Format: Patent
• Language: English
• Published: 03.10.2003
• Edition: 7
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

PROBLEM TO BE SOLVED: To obtain a resin composition which enables a laser process and can be used for a multilayer printed wiring board having excellent strength. SOLUTION: The resin composition may be used for an insulation layer of the multilayer printed wiring board and comprises a thermosetting...