RESIN COMPOSITION AND METHOD OF MANUFACTURING THE SAME

• Main Authors: KISHI TOYOAKI, NAKAMICHI SEI
• Format: Patent
• Language: English
• Published: 03.10.2003
• Edition: 7
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

PROBLEM TO BE SOLVED: To obtain a resin composition which enables a laser process and can be used for a multilayer printed wiring board having excellent strength. SOLUTION: The resin composition may be used for an insulation layer of the multilayer printed wiring board and comprises a thermosetting resin and/or a thermoplastic resin, a dispersion hardening agent having completed the dispersion process with ultrasonic wave vibration, and an inorganic filling material. Moreover, the method of manufacturing the resin composition is proposed to manufacture the resin composition used for the insulation film of the multilayer printed wiring board, comprising the process to obtain a first intermediate body by dissolving the thermosetting resin and/or thermoplastic resin into a solvent, a process to obtain a second intermediate body by dispersing the dispersion hardening agent and inorganic filling material into the solvent, a process to stir the second intermediate body with vibration in the frequency of 20 kHz or higher, and a process to mix the first intermediate body and the second intermediate body obtained by the stirring process. COPYRIGHT: (C)2004,JPO