WALL STRUCTURE

PROBLEM TO BE SOLVED: To provide a wall structure which is constructed by setting tiles on a substrate layer, wherein the tiles are prevented from peeling off from the substrate layer. SOLUTION: The wall structure is constructed by forming the substrate layer 3 on an outer wall board of a steel-fram...

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Bibliographic Details
Main Authors SOTETSU SEIJI, HANADA SHUNICHIRO, FUJITA TAKESHI, KAMIMURA FUKUNOBU
Format Patent
LanguageEnglish
Published 25.09.2003
Edition7
Subjects
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Summary:PROBLEM TO BE SOLVED: To provide a wall structure which is constructed by setting tiles on a substrate layer, wherein the tiles are prevented from peeling off from the substrate layer. SOLUTION: The wall structure is constructed by forming the substrate layer 3 on an outer wall board of a steel-framed structure, and setting the tiles 5 on the substrate layer 3 via an adhesive 4. According to the wall structure, the substrate layer 3 is formed so as to have a plurality of inclined surfaces 3a, 3b, etc., which each protrude outward at a lower portion such that their longitudinal sections form sawteeth, and the tiles 5 are set on the inclined surfaces 3a, 3b, etc., via the adhesive 4. Further, a decorative tile 6 is stuck, to an upper bed of the lower inclined surface 3b at a boundary portion between the upper and lower inclined surface 3a, 3b. The decorative tile 6 has a thickness t2 larger than a thickness t1 of the tile 5 and equal to or smaller than a value of a step dimension D of the boundary portion between the upper and lower inclined surfaces 3a, 3b plus the thickness t1 of the tile 5. In other words, the thickness t2 satisfies the following relationship, t1<t2≤D+t1. COPYRIGHT: (C)2003,JPO
Bibliography:Application Number: JP20020076277