SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

• Main Author: TEJIMA TAKANORI
• Format: Patent
• Language: English
• Published: 04.07.2003
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To prevent a joint member from adhering to the surfaces of conductor members, etc., those contact with resin, in a semiconductor device and its manufacturing method. SOLUTION: In the semiconductor device, a first coating resin 14 is preapplied to side faces of electrode blocks...