SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

• Main Author: TEJIMA TAKANORI
• Format: Patent
• Language: English
• Published: 04.07.2003
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To prevent a joint member from adhering to the surfaces of conductor members, etc., those contact with resin, in a semiconductor device and its manufacturing method. SOLUTION: In the semiconductor device, a first coating resin 14 is preapplied to side faces of electrode blocks 3 as a means for preventing the adhesion of the joint member. Therefore, solder 6 does not adhere to the side faces of the blocks 3 even when the solder 6 creeps up the side faces due to the own weights of members 1-5 when the members 1-5 are joined to each other with the solder 6, because the resin 14 has a nonadhesive property to the solder 6. Since the solder 6 is not interposed between the side faces of the electrode blocks 3 and a second coating resin 15, the adhesion between the side faces of the blocks 3 and the resin 15 can be maintained even when a heat cycle is applied. Consequently, the peeling of a resin 9 from the electrode blocks 3 can be prevented. COPYRIGHT: (C)2003,JPO