SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To prevent a joint member from adhering to the surfaces of conductor members, etc., those contact with resin, in a semiconductor device and its manufacturing method. SOLUTION: In the semiconductor device, a first coating resin 14 is preapplied to side faces of electrode blocks...

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Bibliographic Details
Main Author TEJIMA TAKANORI
Format Patent
LanguageEnglish
Published 04.07.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To prevent a joint member from adhering to the surfaces of conductor members, etc., those contact with resin, in a semiconductor device and its manufacturing method. SOLUTION: In the semiconductor device, a first coating resin 14 is preapplied to side faces of electrode blocks 3 as a means for preventing the adhesion of the joint member. Therefore, solder 6 does not adhere to the side faces of the blocks 3 even when the solder 6 creeps up the side faces due to the own weights of members 1-5 when the members 1-5 are joined to each other with the solder 6, because the resin 14 has a nonadhesive property to the solder 6. Since the solder 6 is not interposed between the side faces of the electrode blocks 3 and a second coating resin 15, the adhesion between the side faces of the blocks 3 and the resin 15 can be maintained even when a heat cycle is applied. Consequently, the peeling of a resin 9 from the electrode blocks 3 can be prevented. COPYRIGHT: (C)2003,JPO
Bibliography:Application Number: JP20010385791