CLEANING TREATMENT APPARATUS AND METHOD

• Main Authors: HIRAKAWA TADAO, KAWAKAMI TSUKASA
• Format: Patent
• Language: English
• Published: 13.12.2002
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CLEANING; CLEANING IN GENERAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; PREVENTION OF FOULING IN GENERAL; SEMICONDUCTOR DEVICES; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a cleaning treatment apparatus that can discriminate hardening and split in the sponge brush of a cleaning tool. SOLUTION: The cleaning treatment apparatus for cleaning a semiconductor wafer by a cleaning tool being rotated and driven has a servo motor 7 for rotating and driving a cleaning tool 8, an vertical controller 17 that drives the cleaning tool in a direction in contact with or apart from the semiconductor wafer and adjusts contact pressure to the substrate of the cleaning tool, a current sensor 13 for detecting the value of a current that flows in the servo motor according to the contact state between the semiconductor wafer and cleaning tool, and an operation treatment section 16 that discriminates the state of the cleaning tool according to the relationship between the amount of movement and the current value being detected by the current sensor, when the washing tool is moved by the vertical controller for allowing a contact state with the semiconductor wafer to change.