TRAY FOR SUBSTRATE TRANSPORT AND MANUFACTURING METHOD THEREFOR

PROBLEM TO BE SOLVED: To solve a problem that temperature distribution easily occurs on a substrate surface and the line width and precision of a circuit pattern fluctuate since durability improves but thermal conductivity between ceramics, and a substrate is deteriorated when a tray for substrate t...

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Main Authors KUROTAKE HIROYUKI, INAMOTO YOSHIMASA, MIYAKE KIYOO
Format Patent
LanguageEnglish
Published 25.10.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Abstract PROBLEM TO BE SOLVED: To solve a problem that temperature distribution easily occurs on a substrate surface and the line width and precision of a circuit pattern fluctuate since durability improves but thermal conductivity between ceramics, and a substrate is deteriorated when a tray for substrate transport is constituted of the ceramics and the coat of the ceramics is formed on the surface of a metallic tray main body like a conventional case. SOLUTION: A material having insulation property and having flexibility is arranged in the recessed part of the tray main body constituted of a material superior in thermal conductivity. A surface outer than the recessed part of the tray main body is constituted of the material having corrosion resistance or sputtering resistance.
AbstractList PROBLEM TO BE SOLVED: To solve a problem that temperature distribution easily occurs on a substrate surface and the line width and precision of a circuit pattern fluctuate since durability improves but thermal conductivity between ceramics, and a substrate is deteriorated when a tray for substrate transport is constituted of the ceramics and the coat of the ceramics is formed on the surface of a metallic tray main body like a conventional case. SOLUTION: A material having insulation property and having flexibility is arranged in the recessed part of the tray main body constituted of a material superior in thermal conductivity. A surface outer than the recessed part of the tray main body is constituted of the material having corrosion resistance or sputtering resistance.
Author KUROTAKE HIROYUKI
INAMOTO YOSHIMASA
MIYAKE KIYOO
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Snippet PROBLEM TO BE SOLVED: To solve a problem that temperature distribution easily occurs on a substrate surface and the line width and precision of a circuit...
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title TRAY FOR SUBSTRATE TRANSPORT AND MANUFACTURING METHOD THEREFOR
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